umshini wokufaka iphini / umshini wokusika izintambo wokuhlubula umshini wokusika umshini wokusika umthofu

Ukusebenzisa ubuchwepheshe bephinikhodi ye-Press-fit ku-Automation Processes Ekhona

Ngisho nangaphambi kokuba ukucutshungulwa okungenamthofu kube yinto ekhathazayo, ukusebenza kwesibili kokudayiswa kulethe izinselele ezinzima.

Ukusebenzisa Ubuchwepheshe Bephini Lokufaka I-Press-fit Ezinqubweni Ezikhona Zokuzenzakalela (1)

Ukuzuza kokubili ukukhiqiza okuphezulu nokuhlanganiswa kwevolumu ngokusebenzisa i-solder tail terminals kwakungenakwenzeka ngaso sonke isikhathi.Lokhu kubaluleke kakhulu embonini yezimoto, lapho izixhumi ezinkulu ezibunjiwe zivame ukusetshenziselwa kokubili amandla kanye namasignali okulawula.Abakhiqizi badinga ukuhlanganisa ukuhlanganiswa okuzenzakalelayo kwezixhumi ngenkathi benciphisa izinkinga ezihambisana nezinqubo zokudayiswa.Ukuze kuhlangatshezwane nalo mgomo, ubuchwepheshe bokulinganisa i-press-fit buvumela ukufakwa komshini onesivinini esikhulu kwamaphinikhodi athobelayo owodwa noma amaningi namatheminali angadingi izinyathelo zokudayiswa ezilandelayo futhi anikeze izinga eliphezulu lamandla okugcina.

Ubuchwepheshe be-press-fit, obaziwa nangokuthi i-interference fit noma i-friction fit, sekufakazelwe futhi busetshenziswa kakhulu embonini yezimoto nezokuxhumana.Ezimweni eziningi, kuqede ukusoda kumasistimu okuxhumana okuxhumeke kakhulu.Iyaqhubeka nokuthuthuka ukuze kuhlangatshezwane nezinselele ezintsha zokukhiqiza nokubhekana nohlu olubanzi lwezidingo zomkhiqizo.

Inselele eyinhloko ihlanganisa ukuzuza ibhalansi efanele phakathi kwamandla okufaka adingekayo kanye nenani lokugcinwa (isb. amandla okuhoxa adingekayo ukuze kukhishwe iphinikhodi).Amandla okugcina kufanele abe seduze ngangokunokwenzeka namandla okufaka ukuze uthole ukuqina okukhulu koxhumo.Ukushintshashintsha kakhulu kwesigaba sokulingana kokucindezela kungaholela ekunciphiseni amandla avamile phakathi kwephini elithobelayo kanye nomgqomo wembobo.Kwehlisa isithunzi amandla okugcina nokusebenza empilweni yomkhiqizo.

I-Gas Tight Fit enokugcinwa okuphezulu

I-YICHUAN inikeza izixazululo ezilingana nabezindaba ezihlinzeka amakhasimende ethu ngoxhumano olungathengiswa, olunamandla ngaphakathi, oluqinile.Izikhonkwane zethu ezithobelanayo zokufaka i-press-fit zihlolwe ngokuphelele kuwo wonke amazinga embonini.Ukulingana kwephinikhodi ye-press-fit fit friction kunikeza uxhumano oluqinile lwegesi olunamandla okugcina anele.Igcina amandla ajwayelekile aphezulu embotsheni efakwe ngembobo (PTH) yebhodi lesifunda eliphrintiwe, futhi iqeda isidingo sokunamathisela.Ngemva kokufakwa kwephinikhodi ehambisanayo ukuxhuma kuqedwa ngendlela ephumelela kakhulu

Ukusebenzisa Ubuchwepheshe Bephini Lokufaka I-Press-fit Ezinqubweni Ezikhona Ezizenzakalelayo (2)

Njengoba ingxenye yeso yenaliti ye-press-fit imunca ukuwohloka kokulingana kwe-friction futhi ayikonakali okuphucwe ngembobo.Kungakho kungenzeka ukususa iphinikhodi yokucindezela ngokuhamba kwesikhathi ngaphandle kokulimala ku-PCB noma isidingo sokusebenza kabusha okubanzi.Kungenzeka ukususa izikhonkwane zokucindezela-fit ezilimele ngosizo lwethuluzi lesandla elilula.Ivumela ukufaka iphinikhodi entsha endaweni endala egqitshwe ngembobo.

Ithrendi eqhubekayo eya kumadizayini we-fine-pitch surface mount technology (SMT) nawo wenziwa waba lula ngokusebenzisa ubuchwepheshe bephini lokucindezela.Njengoba isikhala phakathi kokuxhumana siba sincane, izinselelo ze-solder zikhula kakhulu.Inqubo iyonke kufanele ilawulwe ngokuqinile.Ukufakwa kwe-solder paste kufanele kubanjwe ngaphakathi kokubekezelelana okuqinile ukuze kugwenywe ukubopha amabhuloho noma ukubhola nge-solder phakathi kwamaphedi.Lesi sidingo sokunciphisa ukungqubuzana kwevolumu ye-solder ne-SMT kanye nezimfuneko zokuxhumanisa iphini-in-unamathisele.Ngokuvamile badinga izibopho ezinkulu ze-solder ukuze baqinisekise ukuqina kwamandla angaphandle okuxhuma ngokomzimba.Izikhonkwane ezihambisana nokucindezela ezihambisanayo zivumela umenzi ukuthi asuse izinkinga, amathuluzi akhethekile kanye nezindleko ezengeziwe ezihlobene nezixhumi zokunamathisela kumabhodi amancane e-SMT anephimbo elihle.

Idizayinelwe futhi Yapakishwa Ukusiza Inqubo Yokuzenzakalela

Ukusebenzisa Ubuchwepheshe Bephini Lokufaka I-Press-fit Ezinqubweni Ezikhona Ezizenzakalelayo (3)

Zonke izikhonkwane ezilingana ngokucindezela zinikezwa ngamafomethi aphindekelwayo ngokuqhubekayo njengengxenye eyodwa noma eminingi yesixhumi sendawo ukuze zifakwe ngemishini yokufaka izikhonkwane ezinesivinini esikhulu.Lokhu kwenza ubuchwepheshe bokulingana kwabezindaba buhlanganiswe kahle ngaphakathi kwanoma iyiphi i-SMT ekhona noma imigqa yokucubungula imbobo.Izikhonkwane ze-press-fit zingafakwa ngokuzenzakalelayo njengezixhumi ezihlukene kunoma iyiphi iphethini edingekayo, noma zibekwe njengezixhumi zesihloko sephini, ukusika kusengaphambili kunoma ibuphi ubude obudingekayo kanye/noma isibalo sendawo.Ngokuya ngezidingo zohlelo lokusebenza, izihloko zephinikhodi yokucindezela zitholakala njengokukodwa ngakunye (1 x 1, 1 x 2, njll.) noma okubili-by (2 x 2, 2 x 3, njll.) ukulungiselelwa.

Ngenxa yokuthi i-interconnect ye-press-fit ethobela ngokugcwele iqedwa ngesinyathelo esisodwa, umsebenzi wokufaka ozenzakalelayo ungahlanganiswa cishe kunoma iyiphi iphoyinti ekugelezeni kokukhiqiza kukonke.Ngokuvamile, isinyathelo sokufaka iphinikhodi yokucindezelwa senziwa ekupheleni noma eduze nokuphela kwenqubo;ngemuva kokuthi zonke izingxenye ze-SMT sezibekiwe futhi zithengiswa kabusha.

Ukusebenzisa ubuchwepheshe bokungena kwe-press-fit obungena-solderless ekuxhumekeni ebhodini kuvumela zonke izinqubo ze-SMT (ukuhlolwa kokunamathisela kwe-solder, ukubekwa kwengxenye yohlangothi oluphezulu nangaphansi, ukugeleza kabusha, njll.) ukuthi kwenziwe ngaphandle kokuhlangana ngokuphelele nokuhlanganiswa kwe-interconnect.Lokhu kunciphisa izindleko nezinselele zokuhlanganisa izinyathelo zenqubo ezinzima ezifana nokubekwa ngendlela eyinqaba kwezixhumi, ukuphina ngokunamathisela, ukuhlanganisa okwesibili kanye/noma izinqubo ezenziwa ngesandla.Ukushintsha ukuxhumeka kwe-solder ngobuchwepheshe be-press-fit kuzothuthukisa i-automation kanye nezinqubo zebhizinisi.

Ngaphezu kokwenza lula ukugeleza kokukhiqiza okuphelele, ukufaka ama-solderless interconnects njengesinyathelo sokugcina futhi kugwema ingozi ye-scrap kanye nezindleko zokuphinda zenziwe kabusha okungenzeka kusukela ekuzameni ukuphatha izinqubo ezinzima ze-soldering phezulu nomfula.Zonke ezinye izinyathelo zokucubungula seziqediwe kakade futhi, lapho kufakwa izikhonkwane noma amatheminali, ukuhlanganiswa kokugcina kwenziwa futhi kulungele ukuhlolwa.

I-YICHUAN inikeza imishini yokufaka iphinikhodi enesivinini esikhulu ngobukhulu obuhlukahlukene ezimakethe zaseNyakatho Melika, eYurophu nase-Asia.


Isikhathi sokuthumela: Jun-03-2019